Material Matters Blog
Featured Blogs
OEMs Must Own the Stackup
Bill Hargin of Z-zero: “A lot of people think of impedance and stackups as kind of a monolithic concept, but they’re pretty nuanced, in
Addressing the Issue of Mischara...
Engineers who use laminate materials for printed circuit boards need to be aware that the manufacturers’ numbers describing those materials may not always be
Resistive Loss is Only Skin Deep
Mitigating skin effect’s impact on high-speed signals. WRITTEN BY: BILL HARGIN I’ve spent much of the past seven years dealing with insertion loss as
Why We Simulate
When I was cutting my teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and
Featured Post
The Printed Circuit Designer's
Guide to—Stackups
The design within the design
From material selection and understanding laminate datasheets, to impedance planning, glass weave skew and rigid-flex materials, topic expert Bill Hargin has written a unique book on PCB stackups.
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